Recently, the next generation power device reliability test platform has successfully completed the test task of the first batch of H3TRB test devices, which marked that the Phase I Laboratory of the next generation power device reliability test has successfully come into service after months of equipment procurement, installation, testing and personnel training and the phased construction goal has been successfully realized.
The smart power research project team of Institute of Energy of Hefei Comprehensive National Science Center started building the next generation power device reliability test platform last June. The experimental platform was built with reference to AQG324 industry standard. They purchased environmental test equipment with wider test conditions and high voltage and high current test equipment. In April this year, the first phase of the construction of the reliability test experimental platform for power semiconductor devices was completed. The laboratory area of phase I project is 300 square meters. The laboratory can undertake many professional experimental projects of power semiconductor devices, such as static parameter test, limit capacity test, aging reliability life test, power cycle test and failure analysis. The laboratory management meets the requirements of CNAS standardized laboratory. The laboratory is equipped with special personnel for equipment management and maintenance and personnel training of test equipment is carried out according to the specifications. The laboratory has successively cooperated with Sungrow and Infineon and other companies and has carried out experimental projects.
The next planned laboratory and the enterprise to be incubated will cover an area of about 5000 square meters, with an asset value of nearly 40 million yuan, and will be equipped with a full range of reliability testing equipment and analytical instruments. The overall goal is to build the experimental platform to be a reliability test platform with “international advanced and domestic leading” test capability and capacity, which is oriented to the packaging test research and industrialization of new generation power semiconductor devices (the third generation power semiconductor devices, high-performance silicon-based power semiconductor devices, etc.). The platform will fully support the vehicle specification level reliability test standard of AQG-324 power semiconductor module and AEC-Q101 power semiconductor single tube, as well as the reliability test and research of new generation power semiconductor devices.
Pic 1 Laboratory Panorama
Pic 2 Laboratory Work Scenario
Pic 3 Some members of the reliability evaluation team of next generation power conversion devices and personnel of cooperative enterprises